This item is in: Materials > Electronic and optical materials

Advanced adhesives in electronics

Edited by M O Alam and C Bailey, University of Greenwich, UK

Adhesives are widely used in the manufacture of electronic devices to act as passive and active components. Recently there has been considerable interest in the use of conductive adhesives. This book reviews key types of conductive adhesives, processing methods, properties and the way they can be modelled as well as potential applications.

ISBN 1 84569 576 3
ISBN-13: 978 1 84569 576 7
Q2 2011
300 pages  234 x 156mm  hardback  
Approx. £125.00 / US$210.00 / €155.00

Not yet published

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Contents

Introduction to adhesive joining technology for electronics. Part 1 Types of adhesive: Thermally conductive adhesives; Anisotropic conductive adhesives; Isotropic conductive adhesives; Underfill materials for flip-chip application. Part 2 Processing and properties: Microwave curing of electronic adhesives; Structural integrity of metal-polymer interfaces in microelectronics; The use of nanoscale additives to toughen epoxy adhesive systems; Modelling conductive adhesive properties; Adhesive technology for photonics.